Elixir M2F4G64CB8HB5N-CG Ficha de datos descargar pdf (Pagina 11)

M2F1G64CBH4B5(9)P / M2F2G64CB88B7(H)N / M2F4G64CB8HB5(9)N

1GB: 128M x 64 / 2GB: 256M x 64 / 4GB: 512M x 64

PC3-8500 / PC3-10600 / PC3-12800

Unbuffered DDR3 SDRAM DIMM

REV 1.1 11

10/2010

NANYA reserves the right to change products and specifications without notice.

Environmental Requirements

Symbol

Parameter

Rating

Units

Note

OPR

Module Operating Temperature Range (ambient)

0 to 55

°C

OPR

Operating Humidity (relative)

10 to 90

STG

Storage Temperature (Plastic)

-55 to 100

°C

STG

Storage Humidity (without condensation)

5 to 95

BAR

Barometric Pressure (operating & storage)

105 to 69

K Pascal

1, 2

Note:

1. Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only and device functional

operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect reliability.

2. Up to 9850 ft.

3. The component maximum case temperature shall not exceed the value specified in the component spec.

Absolute Maximum DC Ratings

Symbol

Parameter

Rating

Units

Note

Voltage on VDD pins relative to Vss

-0.4 V ~ 1.975 V

1, 3

DDQ

Voltage on VDDQ pins relative to Vss

-0.4 V ~ 1.975 V

1, 3

, V

OUT

Voltage on I/O pins relative to Vss

-0.4 V ~ 1.975 V

STG

Storage Temperature

-55 to +100

°C

1, 2

Note:

1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of

this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability

2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer

to JESD51-2 standard.

3. VDD and VDDQ must be within 300 mV of each other at all times;and VREF must be not greater

Operating temperature Conditions

Symbol

Parameter

Rating

Units

Note

OPER

Normal Operating Temperature Range

0 to 85

°C

1, 2

Extended Temperature Range

85 to 95

°C

1, 3

Note:

1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For measurement conditions,

please refer to the JEDEC document JESD51-2.

2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the

DRAM case temperature must be maintained between 0 to 85 °C under all operating conditions

3. Some applications require operation of the DRAM in the Extended Temperature Range between 85 °C and 95 °C case temperature. Full

specifications are supported in this range, but the following additional conditions apply:

a) Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 μs. It is also possible to specify

a component with 1X refresh (tREFI to 7.8μs) in the Extended Temperature Range. Please refer to supplier data sheet and/or the

DIMM SPD for option availability.

b) If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh

mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the optional Auto Self-Refresh mode

(MR2 A6 = 1b and MR2 A7 = 0b). Please refer to the supplier data sheet and/or the DIMM SPD for Auto Self-Refresh option

availability, Extended Temperature Range support and tREFI requirements in the Extended Temperature Range.

1 2 ... 6 7 8 9 10 11 12 13 14 15 16 ... 30 31

Comentarios a estos manuales

Sin comentarios

Elixir M2F4G64CB8HB5N-CG Ficha de datos Pagina 11

Comentarios a estos manuales

Relacionado con productos y manuales para Los módulos de memoria Elixir M2F4G64CB8HB5N-CG